Effect of atmospheric plasma treatment on the solderability of a copper sheet with Sn-Ag-Cu alloy

Authors

Michael Andrei C. Paguio Sciences Department, College of Arts, Sciences, and Education, FEATI University
Leo Mendel D. Rosario Sciences Department, College of Arts, Sciences, and Education, FEATI University
Marcedon S. Fernandez Sciences Department, College of Arts, Sciences, and Education, FEATI University
Henry J. Ramos Sciences Department, College of Arts, Sciences, and Education, FEATI University
Roy B. Tumlos Sciences Department, College of Arts, Sciences, and Education, FEATI University

Abstract

An atmospheric microwave plasma pen was utilized to enhance the solderability of a copper sheet with Sn-Ag-Cu alloy (lead-free) solder. The work of adhesion of test liquids (de-ionized water, glycerol, and ethylene glycol) was increased at a
treatment time of just 30 s. The contact angle of the Sn-Ag-Cu solder on the copper sheet was reduced from 53.86o to 38.46o with a treatment time of 60 s. The enhanced solderability of the copper sheet to the lead-free solder is attributed to the increased surface roughness from 313.60 to 382 nm as confirmed by atomic force microscopy.

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Issue

2013: Proceedings of the 31st Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP2013-PA-34

Section

Poster Session PA

Published

2013-10-23

How to Cite

[1]

MAC Paguio, LMD Rosario, MS Fernandez, HJ Ramos, and RB Tumlos, Effect of atmospheric plasma treatment on the solderability of a copper sheet with Sn-Ag-Cu alloy, Proceedings of the Samahang Pisika ng Pilipinas 31, SPP2013-PA-34 (2013). URL: https://proceedings.spp-online.org/article/view/SPP2013-PA-34.