Plasma sputter-type negative ion source deposition of zirconium nitride on aluminum substrate

Abstract

Zirconium nitride was deposited in the surface of aluminum substrate using the plasma sputter-type negative ion source facility. The target bias employed were -200 V, -300 V, and -400 V. The gas ratio of Ar and N₂ was 9:1. Qualitative color variation analysis of samples revealed that as the target bias voltage is increased, the intensity of the yellow color also increases and reaches a darker brown color. X-ray diffraction pattern showed a broad Zr₃N₄ peak for samples deposited using a target bias voltage of -300 and -400 V with the -300 V-sample having a higher intensity. A direct correlation between the target bias voltage and hydrophillicity was observed from the water contact angle measurements. Measured contact angles for treated samples were from 55º to 60º whereas the untreated sample revealed an 80º contact angle.